• Feature Phone PCB

- Board Thickness: 1.6 mm
- Copper Thickness: 35 µm
- Minimum Line Width: 3 mil (0.075 mm)
- Minimum Hole Diameter: 0.2 mm
- Solder Mask Color: Green
- Surface Finishes: ENIG

- Board Thickness: 1.6 mm
- Copper Thickness: 35 µm
- Minimum Line Width: 3 mil (0.075 mm)
- Minimum Hole Diameter: 0.2 mm
- Solder Mask Color: Green
- Surface Finishes: ENIG